lead free smd resettable fuse document no trf12 os 00 2 a issued date 2010/07/09 page 1 / 7 ta - i technology co., ltd specifications are subject to change without notice. customers should verify actual device performance in their spec ific applications. 1. scope this specification applies for the lead - free smd resettable fuse series . 2. construction style 1 style 2 3. type designation trf smd resettable fuse v06 vmax(vdc) 035 i - hold 035 : 0.35 a f 2 lead free v 0 6 : 6 v v08: 8v v12: 12v v13: 13.2v v 15 : 15 v v 1 6 : 1 6 v v30: 30v v60: 60v 12 size 12:1206 ( 3216 ) e packaging e:embossed tape t:paper tape
lead free smd resettable fuse document no trf12 os 00 2 a issued date 2010/07/09 page 2 / 7 ta - i technology co., ltd specifications are subject to change without notice. customers should verify actual device performance in their spec ific applications. 4. dimensions style 1 style 2 dimensions u nit : mm packaging: 3000 pcs. per reel. part d designation min. max. min. max. min. max. min. trf12-012v30-ef 3.00 3.40 1.40 1.80 0.70 1.10 0.25 1 trf12-020v24-ef 3.00 3.40 1.40 1.80 0.48 0.85 0.25 1 TRF12-020V30-EF 3.00 3.40 1.40 1.80 0.40 0.85 0.25 2 trf12-035v06-ef 3.00 3.40 1.40 1.80 0.48 0.85 0.25 1 trf12-035v16-ef 3.00 3.40 1.40 1.80 0.40 0.85 0.25 2 trf12-050v13-ef 3.00 3.40 1.40 1.80 0.48 0.85 0.25 1 trf12-075v06-ef 3.00 3.40 1.40 1.80 0.40 0.70 0.25 1 trf12-110v06-ef 3.00 3.40 1.40 1.80 0.40 0.70 0.25 1 trf12-150v06-ef 3.00 3.40 1.40 1.80 0.40 0.70 0.25 1 trf12-200v06-ef 3.00 3.50 1.40 1.80 0.70 1.60 0.25 1 a b c style
lead free smd resettable fuse document no trf12 os 00 2 a issued date 2010/07/09 page 3 / 7 ta - i technology co., ltd specifications are subject to change without notice. customers should verify actual device performance in their spec ific applications. 5. applications and ratings 6. thermal derating chart part designation current time ri min r1 max (a) (sec) () () trf12-012v30-ef 30 10 0.12 0.29 0.4 1 0.20 1.35 8.50 trf12-020v24-ef 24 10 0.20 0.46 0.6 1 0.60 0.60 2.60 TRF12-020V30-EF 30 60 0.20 0.40 0.6 1 0.60 0.60 3.30 trf12-035v06-ef 6 100 0.35 0.75 0.6 8 0.10 0.30 1.20 trf12-035v16-ef 16 20 0.35 0.75 0.6 3.5 0.10 0.30 1.40 trf12-050v13-ef 13.2 100 0.50 1.00 0.4 8 0.10 0.15 0.70 trf12-075v06-ef 6 100 0.75 1.50 0.4 8 0.10 0.10 0.40 trf12-110v06-ef 6 100 1.10 2.20 0.6 8 0.10 0.06 0.20 trf12-150v06-ef 6 100 1.50 3.00 0.6 8 0.30 0.03 0.13 trf12-200v06-ef 6 100 2.00 4.00 0.7 8 1.00 0.02 0.085 maximum time to trip at 23 resistance at 23 i hold = hold current. maximum current device will sustain for 30min without tripping in 23c still air. i trip = trip current. minimum current at which the device will trip in 23c still air. v max = maximum voltage device can withstand without damage at rated current. i max = maximum fault current device can withstand without damage at rated voltage. p d = power dissipated from device when in the tripped state at 23c still air. ri min = typical resistance of device in initial (un-soldered) state. r1 max = maximum resistance of device at 23c measured one hour post reflow. caution : operation beyond the specified ratings may result in damge and possibile arcing and flame. v max (vdc) i max (a) i hold at 23 i trip at 23 p d typ. (w) part designation -40 -20 0 23 40 50 60 70 85 trf12-012v30-ef 0.19 0.17 0.15 0.12 0.11 0.10 0.09 0.08 0.07 trf12-020v24-ef 0.30 0.27 0.24 0.20 0.18 0.16 0.14 0.12 0.11 TRF12-020V30-EF 0.30 0.27 0.24 0.20 0.18 0.16 0.14 0.12 0.10 trf12-035v06-ef 0.51 0.46 0.40 0.35 0.30 0.27 0.24 0.22 0.18 trf12-035v16-ef 0.58 0.51 0.44 0.35 0.31 0.28 0.24 0.21 0.16 trf12-050v13-ef 0.76 0.68 0.59 0.50 0.44 0.40 0.35 0.32 0.26 trf12-075v06-ef 1.11 1.00 0.85 0.75 0.67 0.61 0.52 0.50 0.42 trf12-110v06-ef 1.64 1.46 1.30 1.10 0.92 0.83 0.80 0.65 0.52 trf12-150v06-ef 2.20 1.99 1.77 1.50 1.34 1.23 1.10 1.01 0.84 trf12-200v06-ef 2.88 2.61 2.28 2.00 1.80 1.66 1.51 1.39 1.19 maximum ambient operating temperature(t mao ) vs. hold current (i hold ) (amps)
lead free smd resettable fuse document no trf12 os 00 2 a issued date 2010/07/09 page 4 / 7 ta - i technology co., ltd specifications are subject to change without notice. customers should verify actual device performance in their spec ific applications. 7. typical time to trip at 23 c the time to trip curves represent typical performance of a device in a simulated application environment. actual performance in specific customer applications may differ from these values due to the influence of other variables.
lead free smd resettable fuse document no trf12 os 00 2 a issued date 2010/07/09 page 5 / 7 ta - i technology co., ltd specifications are subject to change without notice. customers should verify actual device performance in their spec ific applications. 8. e nvironment 8.1 operating conditions op erating temperature : - 40 125 test item condition resistance change passive aging 85 ,1000hr 5% typical humidity aging 85 ,85%r.h,1 000 hr 5% typical thermal shock 85 to - 40 ,2 0times 10 % typical resistance to solvent mil - std - 202,method215 no change vibration mil - std - 883c ,method20 07.1 condition a no change 8.3 solder reflow recommendations ? recommend reflow methods : ir, vapor phase oven, hot air oven. ? ? ?
lead free smd resettable fuse document no trf12 os 00 2 a issued date 2010/07/09 page 6 / 7 ta - i technology co., ltd specifications are subject to change without notice. customers should verify actual device performance in their spec ific applications. 9. typical part marking style 1 : style 2 : 10. storage conditions : temperature : 40 max , humidity : 4 0 %~70% 11. shelf life: 2 year s from manufacturing date
lead free smd resettable fuse document no trf12 os 00 2 a issued date 2010/07/09 page 7 / 7 ta - i technology co., ltd specifications are subject to change without notice. customers should verify actual device performance in their spec ific applications. 12. taping & reel
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